By F. G. Yost, F. M. Hosking, D. R. Frear (auth.), F. G. Yost, F. M. Hosking, D. R. Frear (eds.)
In 1992 Congress handed the protection production Engineering schooling Act with the rationale of encouraging educational associations to extend their emphasis on production curricula. the necessity for this incentive to combine the educational and business groups used to be transparent: gaps in production technology have been inhibiting the evolution of latest production applied sciences which are required for the U.S. to keep up a aggressive posture on this planet market. the military examine Laboratory and Sandia nationwide Laboratories sought to give a contribution to the congressional reason by means of starting up a brand new sequence of graduate point university textbooks. The target used to be to concentration next-generation scientists onto concerns that have been universal to the desires of the industrial marketplace, the affordability of DoD guns structures, and the mobilization readiness of the U.S. military. The textbook The Mechanics of Solder Wetting and Spreading used to be written during this spirit by way of nationally popular scientists for academe and undefined. examine ers utilizing the ebook are inspired to formulate courses that might determine scien tific correlations among production procedure controls and product reliability. Such correlations are necessary to the construction of a brand new electronics that is dependent upon the futuristic suggestions of digital Factories, Prototyping, and Testing.
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In 1992 Congress handed the protection production Engineering schooling Act with the motive of encouraging educational associations to extend their emphasis on production curricula. the necessity for this incentive to combine the tutorial and commercial groups used to be transparent: gaps in production technological know-how have been inhibiting the evolution of latest production applied sciences which are required for the U.
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Additional resources for The Mechanics of Solder Alloy Wetting and Spreading
2 GAP DEPTHS (MILS) (8) Ni-Cu-Sn Figure 2-9 X-ray photographs of solder flow, other solderability test methods Globule Test A solderability test that is exclusively used for component leads is the globule test. With this test method, the component lead is brought down to bisect the globule as a timer is started. As wetting occurs, the globule flows over the lead and surrounds it. In doing so, the solder trips the timer, thereby recording the wetting time for the lead. The test may not work well with very thin leads that lack the strength to bisect the globule.
The reactions mentioned above are the result of the distillation at 1500-170°C. Heating regimes up to 300°C, as in soldering, provide a far wider range of possibilities. Reaction among the abietic acid types via dehydrogenation at 250°C270°C lead to further production of dehydroabietic acid, while at 300°C hydrogenation of neoabietic acid initiates a reversible reaction to abietic acid. By comparison the pimaric acid types appear relatively stable. Reactions of this type must be responsible for many residues, together with a number of metal salts of these acids.
For more information on surface oxidation and its consequences, see Chapter 6 of this book. 6 CONCLUSIONS We have seen some of the major problem areas facing solderability testing today. The need to obtain values for solderability is being addressed by the wider use of the wetting balance and the promise of alternative tests still being developed. The consistency problem is being investigated by the Institute for Interconnecting and Packaging of Electronic Circuits (IPC) Wetting Balance Task Group and others, and is being addressed by the test equipment makers who hope that more automation will produce more consistent results.